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The paper deals with solderability analysis of ITO ceramics (In2O3/SnO2) by metals. SnInAgeTi soft active solder was used for experiments. Solder was actived by power ultrasound in air without flux. The analysis of the interface of phases between solder and ceramics was carried out to determine ultrasonic impact on active metal and identify creation mechanism of joint on the ceramic side.

eISSN:
1338-0532
ISSN:
1336-1589
Langue:
Anglais
Périodicité:
2 fois par an
Sujets de la revue:
Engineering, Introductions and Overviews, other