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The paper deals with solderability analysis of ITO ceramics (In2O3/SnO2) by metals. SnInAgeTi soft active solder was used for experiments. Solder was actived by power ultrasound in air without flux. The analysis of the interface of phases between solder and ceramics was carried out to determine ultrasonic impact on active metal and identify creation mechanism of joint on the ceramic side.

eISSN:
1338-0532
ISSN:
1336-1589
Idioma:
Inglés
Calendario de la edición:
2 veces al año
Temas de la revista:
Engineering, Introductions and Overviews, other