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S. Zheng
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Guohao Wu
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Suoliang Zhang
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Jie Su
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Lei Liu
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Fang Wang
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Rui Zhao
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China
Xiaobing Yan
Research Center for Computational Materials & Device Simulations, College of Electronic & Informational Engineering, Hebei University, Baoding, 071002, P.R. China