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Fig. 1

Depth profiles of Si, O, N and H in an ON structure annealed at 700 °C.
Depth profiles of Si, O, N and H in an ON structure annealed at 700 °C.

Fig. 2

SIMS depth distribution of oxygen concentration for samples annealed at different temperatures.
SIMS depth distribution of oxygen concentration for samples annealed at different temperatures.

Fig. 3

SIMS depth distributions of Si/N ratio on ON structure for as-deposited and annealed at: 500 °C, 700 °C, 900 °C and 1000 °C.
SIMS depth distributions of Si/N ratio on ON structure for as-deposited and annealed at: 500 °C, 700 °C, 900 °C and 1000 °C.

Fig. 4

SIMS depth distributions of O/N ratio for as deposited and annealed films at temperatures 500 °C, 700 °C, 900 °C and 1000 °C.
SIMS depth distributions of O/N ratio for as deposited and annealed films at temperatures 500 °C, 700 °C, 900 °C and 1000 °C.

Fig. 5

Typical RBS spectrum of ON structure recorded with He+2 ions at 2 MeV. Simulation by SIMNRA is given for comparison. Chemical symbol arrows are given to show the signal of each element located at the film surface.
Typical RBS spectrum of ON structure recorded with He+2 ions at 2 MeV. Simulation by SIMNRA is given for comparison. Chemical symbol arrows are given to show the signal of each element located at the film surface.

Fig. 6

First derivative AES survey spectrum of oxide/nitride film obtained after dry oxidation of SiNx and annealed at 700 °C during 30 min.
First derivative AES survey spectrum of oxide/nitride film obtained after dry oxidation of SiNx and annealed at 700 °C during 30 min.

Fig. 7

The EDX spectrum of a typical oxide/nitride film with similar amounts of nitrogen and oxygen. Electron beam energy: 5 keV and the detection take-off angle 35°.
The EDX spectrum of a typical oxide/nitride film with similar amounts of nitrogen and oxygen. Electron beam energy: 5 keV and the detection take-off angle 35°.

Fig. 8

Correlation between O/Si and N/Si with annealing temperature determined by EDX in oxide/nitride film oxidized at 950 °C during 3 hours. The SiNx films were deposited by PECVD with R = 6.
Correlation between O/Si and N/Si with annealing temperature determined by EDX in oxide/nitride film oxidized at 950 °C during 3 hours. The SiNx films were deposited by PECVD with R = 6.
eISSN:
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Language:
English
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Journal Subjects:
Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties