<abstract xmlns="http://www.w3.org/1999/xhtml"><p> This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives “EPO-TEKⓇ H20S” and “MG8331S” on three types of substrates (FR-4, MELINEXⓇST504, DuPont™ PyraluxⓇAC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.</p></abstract>

This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives “EPO-TEKⓇ H20S” and “MG8331S” on three types of substrates (FR-4, MELINEXⓇST504, DuPont™ PyraluxⓇAC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.

Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

University of West Bohemia, Faculty of Electrical Engineering, Univerzitni 8, 306 14 Pilsen, Czech Republic

Department of Technologies and Measurement

Regional Innovation Centre for Electrical Engineering (RICE)

Journal of Electrical Engineering

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives “EPO-TEKⓇ H20S” and...

Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Online veröffentlicht: 28. Juni 2016

Seitenbereich: 177 - 184

Eingereicht: 25. März 2015

DOI: https://doi.org/10.1515/jee-2016-0025

Schlüsselwörter
electrically conductive adhesive, flexible substrate, shear strength, quantity of adhesives, factor analysis, glued joint

© Faculty of Electrical Engineering and Information Technology, Slovak University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Online veröffentlicht: 28. Juni 2016

Seitenbereich: 177 - 184

Eingereicht: 25. März 2015

DOI: https://doi.org/10.1515/jee-2016-0025

Schlüsselwörterelectrically conductive adhesive, flexible substrate, shear strength, quantity of adhesives, factor analysis, glued joint

© Faculty of Electrical Engineering and Information Technology, Slovak University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Schlüsselwörter
electrically conductive adhesive, flexible substrate, shear strength, quantity of adhesives, factor analysis, glued joint