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Epoxy adhesive formulations using latent imidazole metal cation complexes


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Pilawka, R., Spychaj, T. & Leistner, A. (2008). Compositions and epoxy materials hardened with imidazole and metal cation complexes. Polimery 53, 526-530 (in Polish).Search in Google Scholar

Hamerton, I., Howlin, J. B. & Jepson, P. (2002). Metals and coordination compounds as modifiers for epoxy resins. Coordination Chemistry Reviews 224, 67-85.10.1016/S0010-8545(01)00393-9Search in Google Scholar

Barton, J. M., Hamerton, I., Howlin, J. B., Jones, J. R. & Sh, Liu (1998). Studies of cure schedule and final property relationships of a commercial epoxy resin using modified imidazole curing agents. Polymer 39, 1929-1937. DOI: PIh S0032-3861(97)00372-8.10.1016/S0032-3861(97)00372-8Search in Google Scholar

Dowbenko, R. & Anderson, C. C. (1972). U. S. Patent No. 3 635 894. Washington, D. C.: U. S. Patent Office.Search in Google Scholar

Dowbenko, R. & Anderson, C. C. (1972). U. S. Patent No. 3 677 978. Washington, D. C.: U. S. Patent Office.Search in Google Scholar

Barton, J. M (1984), U. S. Patent No. 4 487 914. Washington, D. C.: U. S. Patent Office.Search in Google Scholar

Ohnishi, K. & Nishiguchi, Sh. (1998), U. S. Patent No. 5 789 498. Washington, D. C.: U. S. Patent Office.Search in Google Scholar

eISSN:
1899-4741
ISSN:
1509-8117
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Industrial Chemistry, Biotechnology, Chemical Engineering, Process Engineering