A comparative study of dip coating and spray pyrolysis methods for synthesizing ITO nanolayers by using Ag colloidal sol

[1] Houng B., Appl. Phys. Lett., 87 (2005), 251922. http://dx.doi.org/10.1063/1.214922310.1063/1.2149223Search in Google Scholar

[2] Armelao L., Barreca D., Bottaro G., Gasparotto A., Gross S., Maragno C., Tondello E., Chem. Rev., 250 (2006), 1294. 10.1016/j.ccr.2005.12.003Search in Google Scholar

[3] Buhler G., Tholmann D., Feldmann C., Adv. Mater., 19 (2007), 2224. http://dx.doi.org/10.1002/adma.20060210210.1002/adma.200602102Search in Google Scholar

[4] Viespe C., Nicolae L., Sima C., Grigorlu C., Medianu R., Thin Solid Films, 515 (2007), 8771. http://dx.doi.org/10.1016/j.tsf.2007.03.16710.1016/j.tsf.2007.03.167Search in Google Scholar

[5] Takaki S., Matsumoto K., Suzuki K., Appl. Surf. Sci., 33/34 (1988), 919. http://dx.doi.org/10.1016/0169-4332(88)90399-610.1016/0169-4332(88)90399-6Search in Google Scholar

[6] Djaoued Y., Phong V.H., Badilescu S., Ashrit P.V., Girouard F.E., Truong V.V., Thin Solid Films, 293 (1997), 108. http://dx.doi.org/10.1016/S0040-6090(96)09060-810.1016/S0040-6090(96)09060-8Search in Google Scholar

[7] Yamamoto O., Sasamoto T., Inagaki M., J. Mater. Res., 7 (1992), 2488. http://dx.doi.org/10.1557/JMR.1992.248810.1557/JMR.1992.2488Search in Google Scholar

[8] Toki M., Aizawa M., J. Sol-Gel. Sci. Techn., 8 (1997), 717. 10.1007/BF02436928Search in Google Scholar

[9] Stoica T.F., Stoica T.A., Vanca V., Lakatos E., Zaharescu M., Thin Solid Films., 483 (1999), 273. http://dx.doi.org/10.1016/S0040-6090(99)00136-410.1016/S0040-6090(99)00136-4Search in Google Scholar

[10] Major S., Chopra K.L., Sol. Energ. Mater., 17 (1988), 319. http://dx.doi.org/10.1016/0165-1633(88)90014-710.1016/0165-1633(88)90014-7Search in Google Scholar

[11] Rozati S.M., Ganji T., Renew. Energ., 29 (2004), 1671. http://dx.doi.org/10.1016/j.renene.2004.01.00810.1016/j.renene.2004.01.008Search in Google Scholar

[12] Ramaiah K.S., Raja V.S., Bhathagar A.K., Tomlinso R.D., Pilkington R.D., Hill A.B., Chang S.J., Suy K., Juang F.S., Semicond. Sci. Tech., 15 (2000), 676. http://dx.doi.org/10.1088/0268-1242/15/7/30510.1088/0268-1242/15/7/305Search in Google Scholar

[13] Sheu J.K., Su Y.K., Chi G.C., Jou M.J., Chang C.M., Appl. Phys. Lett., 72 (1999), 3317. http://dx.doi.org/10.1063/1.12163610.1063/1.121636Search in Google Scholar

[14] Cali C., Mosca M., Targia G., Solid State Electron., 42 (1998), 877. http://dx.doi.org/10.1016/S0038-1101(98)00084-710.1016/S0038-1101(98)00084-7Search in Google Scholar

[15] Maruyama T., Fukui K., J. Appl. Phys., 70 (1991), 3848. http://dx.doi.org/10.1063/1.34918910.1063/1.349189Search in Google Scholar

[16] Vetrone J., Chung Y.W., J. Vac. Sci. Technol. A, 9 (1991), 3041. http://dx.doi.org/10.1116/1.57717010.1116/1.577170Search in Google Scholar

[17] Mattox D.M., Thin Solid Films, 204 (1991), 25. http://dx.doi.org/10.1016/0040-6090(91)90491-F10.1016/0040-6090(91)90491-FSearch in Google Scholar

[18] Beaurain A., Luxembourg D., Dufour C., Koncar V., Capoen B., Bouazaoui M., Thin Solid Films, 516 (2008), 4102. http://dx.doi.org/10.1016/j.tsf.2007.10.02110.1016/j.tsf.2007.10.021Search in Google Scholar

[19] Stoica T.F., Teodorescu V.S., Blanchin M.G., Stoi T.A., Gartner M., Losurdo M., Zaharescu M., Mater. Sci. Eng. B-Adv., 101 (2003), 222. http://dx.doi.org/10.1016/S0921-5107(02)00667-010.1016/S0921-5107(02)00667-0Search in Google Scholar

[20] Mohlkar A.V., Pawar S.M., Rajpure K.Y., Patil P.S., Bhosale C.H., Kim J.H., J. Therm. Spray. Techn., 19 (2009), 531. http://dx.doi.org/10.1007/s11666-009-9412-410.1007/s11666-009-9412-4Search in Google Scholar

[21] Agashe C., Marateh B.R., J. Phys. D. Appl. Phys., 26 (1993), 2049. http://dx.doi.org/10.1088/0022-3727/26/11/03210.1088/0022-3727/26/11/032Search in Google Scholar

[22] Rozati S.M., Ganji T., Am. J. Appl. Sci., 2(6) (2005), 1106. 10.3844/ajassp.2005.1106.1108Search in Google Scholar

[23] Yang L.L., He X.D., He F., Li Y.B., Zhang S., Anc T., Zheng W.T., Thin Solid Films, 517 (2009), 4979. http://dx.doi.org/10.1016/j.tsf.2009.03.00810.1016/j.tsf.2009.03.008Search in Google Scholar

[24] Liu J., Wu D., Zeng S.H., J. Mater. Process. Tech., 209 (2009), 3943. http://dx.doi.org/10.1016/j.jmatprotec.2008.09.01610.1016/j.jmatprotec.2008.09.016Search in Google Scholar