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Powder Metallurgy Progress
Volume 18 (2018): Issue 1 (June 2018)
Open Access
Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)
P. Manoj Kumar
P. Manoj Kumar
,
G. Gergely
G. Gergely
,
D. K. Horváth
D. K. Horváth
and
Z. Gácsi
Z. Gácsi
| Jul 25, 2018
Powder Metallurgy Progress
Volume 18 (2018): Issue 1 (June 2018)
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Published Online:
Jul 25, 2018
Page range:
49 - 57
DOI:
https://doi.org/10.1515/pmp-2018-0006
Keywords
Lead-free solder
,
Sn–Ag–Cu alloys
,
Microstructure
,
Mechanical properties
© 2018 P. Manoj Kumar et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
P. Manoj Kumar
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
Hungary
G. Gergely
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
Hungary
D. K. Horváth
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
Hungary
Z. Gácsi
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc
Hungary