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The impact of medium frequency pulsed magnetron discharge power on the single probe Langmuir measurements and resulted plasma parameters


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Fig. 1

The WMK-50 magnetron source current and voltage waveforms while driven by the MSS-14 power supply. The voltage waveforms show the difference in the discharge voltage pulses caused by different values of the target material ISEE (Ion induced Secondary Electron Emission) coefficient.
The WMK-50 magnetron source current and voltage waveforms while driven by the MSS-14 power supply. The voltage waveforms show the difference in the discharge voltage pulses caused by different values of the target material ISEE (Ion induced Secondary Electron Emission) coefficient.

Fig. 2

Waveforms of the MSS-14 power supply output current pulses while driving the WMK-50 magnetron equipped with titanium target. The time point of zero indicates the trigger moment of the oscilloscope time base.
Waveforms of the MSS-14 power supply output current pulses while driving the WMK-50 magnetron equipped with titanium target. The time point of zero indicates the trigger moment of the oscilloscope time base.

Fig. 3

Details of the Langmuir probe measurements arrangement indicating two chosen spatial positions.
Details of the Langmuir probe measurements arrangement indicating two chosen spatial positions.

Fig. 4

The electron current curves calculated from Langmuir probe I-V characteristics measured at position No. 1 for (a) titanium and (b) copper sputtering processes, at discharge power of 1; 3; 5 kW.
The electron current curves calculated from Langmuir probe I-V characteristics measured at position No. 1 for (a) titanium and (b) copper sputtering processes, at discharge power of 1; 3; 5 kW.

Fig. 5

The electron current curves calculated from Langmuir probe I-V characteristics measured at position No. 2 for (a) titanium and (b) copper sputtering processes, at discharge power of 1; 3; 5 kW.
The electron current curves calculated from Langmuir probe I-V characteristics measured at position No. 2 for (a) titanium and (b) copper sputtering processes, at discharge power of 1; 3; 5 kW.

Fig. 6

The electron current ratios calculated in electron saturation regions of probe I-V characteristics for (a) titanium and (b) copper sputtering processes.
The electron current ratios calculated in electron saturation regions of probe I-V characteristics for (a) titanium and (b) copper sputtering processes.

Fig. 7

Langmuir probe current waveforms recorded during titanium sputtering at +10 V of probe voltage.
Langmuir probe current waveforms recorded during titanium sputtering at +10 V of probe voltage.

Fig. 8

The curves of probe electron current for (a) copper and (b) titanium sputtering processes at position 1, calculated with different value pairs of discharge power (PE1:PE2).
The curves of probe electron current for (a) copper and (b) titanium sputtering processes at position 1, calculated with different value pairs of discharge power (PE1:PE2).
eISSN:
2083-134X
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties