<abstract xmlns="http://www.w3.org/1999/xhtml"><p>This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were performed. Based on obtained results, the tenth process was prepared and performed (for future ISFET structures manufacturing). Round aluminum (Al) electrodes were evaporated on the top of deposited layers. The MIS capacitor structures enabled a subsequent electrical characterization of the AlN films by means of current-voltage (I-V) and capacitance-voltage (C-V) measurements. Based on these results, the main parameters of investigated layers were obtained. Moreover, the paper describes the technology of fabrication and electrical characterization of ISFET transistors and possibility of their application as ion sensors.</p></abstract>

This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were performed. Based on obtained results, the tenth process was prepared and performed (for future ISFET structures manufacturing). Round aluminum (Al) electrodes were evaporated on the top of deposited layers. The MIS capacitor structures enabled a subsequent electrical characterization of the AlN films by means of current-voltage (I-V) and capacitance-voltage (C-V) measurements. Based on these results, the main parameters of investigated layers were obtained. Moreover, the paper describes the technology of fabrication and electrical characterization of ISFET transistors and possibility of their application as ion sensors.

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were...

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Published Online: Jan 06, 2016

Page range: 669 - 676

Received: Jan 13, 2014

Accepted: Jun 16, 2015

DOI: https://doi.org/10.1515/msp-2015-0095

Keywords
ISFET/MISFET technology, AlN, aluminum nitride, magnetron sputtering

© 2015 Piotr Firek et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Published Online: Jan 06, 2016

Page range: 669 - 676

Received: Jan 13, 2014

Accepted: Jun 16, 2015

DOI: https://doi.org/10.1515/msp-2015-0095

KeywordsISFET/MISFET technology, AlN, aluminum nitride, magnetron sputtering

© 2015 Piotr Firek et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Keywords
ISFET/MISFET technology, AlN, aluminum nitride, magnetron sputtering