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Journals
Journal of Electrical Engineering
Volume 68 (2017): Issue 2 (March 2017)
Open Access
Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
Alena Pietrikova
Alena Pietrikova
,
Tomas Girasek
Tomas Girasek
,
Peter Lukacs
Peter Lukacs
,
Tilo Welker
Tilo Welker
and
Jens Müller
Jens Müller
| May 11, 2017
Journal of Electrical Engineering
Volume 68 (2017): Issue 2 (March 2017)
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Published Online:
May 11, 2017
Page range:
132 - 137
Received:
Apr 10, 2016
DOI:
https://doi.org/10.1515/jee-2017-0018
Keywords
thermal simulation
,
thermal resistance
,
LTCC
,
cooling channels
© Faculty of Electrical Engineering and Information Technology, Slovak University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Alena Pietrikova
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice
Košice, Slovakia
Tomas Girasek
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice
Košice, Slovakia
Peter Lukacs
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice
Košice, Slovakia
Tilo Welker
Electronics Technology Group, Technical University of Ilmenau
Ilmenau, Germany
Jens Müller
Electronics Technology Group, Technical University of Ilmenau
Ilmenau, Germany