Development of Numerical Model and Comparison with the Analytical Model for Predicting the Wire Effects in Wire Electric Discharge Grinding

This paper discusses the development of a numerical model and its comparison with the analytical model to predict the wire deflection in WEDG. The movement of wire between upper and lower guides creates vibration during the machining process which can create micro deflection of the wire. The Finite Element Analysis model [FEA] for the wire deflection is analyzed and compared with the analytical model. The deflection of the wire due to the input current may affect the machining of micro parts, which will be used for further research in micro machining and also will help us to choose the parameters such as current, spark gap, wire feed, and the speed of the workpiece during micro machining with WEDG. The FEA results for various forces were compared with the analytical results and found that the developed numerical model results are in good agreement.