Experimental Investigations on Impact Toughness and Shear Strength of Novel Lead Free Solder Alloy Sn-1Cu-1Ni-XAg

S Jayesh 1  and Jacob Elias 2
  • 1 Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, India
  • 2 Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, India


Lead is known to be banned in alloy making, highlighting toxicity concerns and environmental legislations. Researchers and scholars around the globe were in immediate search of new lead free solder alloys which could potentially replace the old Sn-Pb alloy. In this comprehensive study, shear strength and impact toughness tests were conducted on Sn-1Cu-1Ni when different amounts of Ag (0.25, 0.5, 0.75 1 % by wt.) is added. Shear strength test is tested using micro force test system. Impact toughness test is analyzed using Charpy impact test set up by calculating the energy difference before and after impact. The study reveals that, Ultimate shear stress increased from 19 MPa to 21.3 MPa. Yield strength increased from 27.4 MPa to 29.7 Mpa. Impact toughness of the alloys increased from 9.4 J to 10.1 J. Thus, Sn-1Cu-1Ni-1Ag is found to have improved shear strength and impact toughness than Sn-1Cu-1Ni.

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  • [1] Schwartz, MM.: Soldering: Understanding the basics. 1st edition. ASM International, USA, 2014

  • [2] Manko, HH.: Solder and Soldering. 2nd edition. New York : McGraw-Hill, 1979

  • [3] Cheng, S., Huang, C-M., Pecht, M.: A review of lead-free solders for electronics applications. Microelectronics Reliability, 2017, 10.1016/j.microrel.2017.06.016

  • [4] European Parliament. Proposal for a Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment and on the restriction of the use of certain hazardous substances in electrical and electronic equipment. COM 2000;:347

  • [5] Gain, AK., Zhang, L.: J. Mater. Sci. Mater. Electron., vol. 27, 2016, p. 781

  • [6] Gain, AK., Chan, YC., Yung, KC., Sharif, A., Ali, L.: Mater. Sci. Eng. B, vol. 162, 2009, p. 92

  • [7] Chang, C., Chuang, TH., Feng, LP., Tsao, LC.: Mater. Des., vol. 32, 2011, p. 4720

  • [8] Leong, L., Fang, CJ., Chu, CP.: J. Mater. Sci. Mater. Electron., vol. 22, 2011, p. 1443

  • [9] Chen, S., Kaoa, CR.: J. Alloys Compd., vol. 520, 2012, p. 244

  • [10] Jayesh, S., Elias, J.: Met. Mater. Int., 2019, https://doi.org/10.1007/s12540-019-00305-3

  • [11] Elias, JSJ.: Lett. Mater., vol. 9, 2019, no. 2, p. 239

  • [12] Jayesh, S., Jacob, E.: Int. J. Simul. Multisci. Des. Optim., 10.1051/smdo/2019013


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