Cooling Methods for High-Power Electronic Systems

Cooling Methods for High-Power Electronic Systems

Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.

If the inline PDF is not rendering correctly, you can download the PDF file here.

  • A. D. Rajapakse, A. M. Gole, and P. L. Wilson, "Approximate loss formulae for estimation of IGBT switching losses through EMTP-type simulations," presented at the 6th Int. Conf. Power System Transients, Montreal, QC, Canada, Jun. 19-23, 2005.

  • H. Rüedi and D. Tollik, "Development of Modular High-Power IGBT Stacks", Power Conversion Conference PCIM 2001, Nuremberg, Germany, June 2001, pp.1-6.

  • B.-C. Charboneau, "Double-sided liquid cooling for power semiconductor devices using embedded power technology," M.S. thesis, Blacksburg, Virginia: Virginia Polytechnic institute and State University, 2005, pp. 1-2…17-23.

  • G. Feix; Dieckerhoff, S.; Allmeling, J.; Schonberger, J., "Simple methods to calculate IGBT and diode conduction and switching losses", Power Electronics and Applications, EPE '09 13th European Conference, 8-10 Sept. 2009, pp.1-8.

  • "Heatsink Characteristics", International Rectifier Application Note AN-1057, [Online]. Available: http://www.irf.com/technical-info/appnotes/an-1057.pdf

  • Ahmed, M.M.R.; Putrus, G.A.; Ran, L.; "Predicting IGBT junction temperature under transient condition," Industrial Electronics, 2002. ISIE 2002. Proceedings of the 2002 IEEE International Symposium, pp. 874-877 vol.3, 2002

  • A. Bhalla, "Thermal resistance characterization of Power MOSFETs," Alpha & Omega Semiconductor, Jan. 2003, [Online]. Available at http://www.aosmd.com/pdfs/appNotes/character_mosfet.pdf

  • Ansys homepage. [Online]. Available: http://www.ansys.com

  • Semikron Applicaion Manual. [Online]. Available: http://www.semikron.com

  • Wakefield Engineering Inc homepage. [Online]. Available: http://www.wakefield.com

  • A. Kolpakov, "Cooling of High-Power Systems," Power Electronics Magazine, №3 June 2010, ISSN: 2079-9322. [in russian].

  • Lytron® Total thermal solutions™ homepage. [Online]. Available: http://www.lytron.com/

  • M. Iyengar, Garimella, S. V.; "Thermal Optimization and Design for Manufacturability of Liquid-Air Hybrid Cooling Systems, " Electronics Cooling Vol. 14(3), pp. 14-21, August 2008.

  • Jeffers, N., Punch, J. and Walsh, E., "An Experimental Characterisation of Miniature-Scale Cold Plates for Electronics Cooling Applications", Proceedings ASME-JSME Thermal Engineering and Summer Heat Transfer Conference, HT2007-321537, Vancouver, BC, Canada, July 8-12, 2007.

  • DAU Ges.m.b.H & CO.KG homepage. [Online]. Available: http://www.dau-at.com

  • G. Upadhya, "Cooligy™ Active Micro-Structure™ Cooling Offers Key to Advanced Processor Performance and Quieter Systems," Cooligy, a Division of Emerson Network Power. [Online]. Available: http://www.cooligy.com/pdf/Cooligy_MicroStructure_White_Paper.pdf

  • J. Schulz-Harder, "Review on highly integrated solutions for power electronic devices," Proceedings of the conference on integrated power electronics systems CIPS'2008, Nuremberg, Germany.

  • R. Remsburg, "Nonlinear Fin Patterns Keep Cold Plates Cooler," Amulaire Thermal Technology, Feb 1, 2007. [Online]. Available: http://powerelectronics.com/thermal_management/liquid_cooling/702PET21.pdf

  • L. Sobotka and R. Herrmann, "Intelligent Power Modules Drive Public Transport," Power Electronics Europe, Issue 7, Oct. 2009.

  • "Cooling DC-DC Converters", Power-One application note. Jan 27, 2003 [Online]. Available: http://www.lens.unifi.it/ew/dwl.php?dwl=ZGF0YXNoZWV0cy9Qb3dlck9uZV9UaGVybWFsWzE0XS5wZGY=&mtyp=application/pdf

  • D. Hirschi, "Understanding Differences Between Thermal Interface Materials: Improve your ability to specify the optimum TIM," Dow Corning Corporation, 2008. [Online]. Available: http://www.dowcorning.com/content/publishedlit/11-1708-01.pdf

  • Chia-Pin Chiu; Biju Chandran; Mello, K.; Kelley, K., "An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications," Electronic Components and Technology Conference, 2001. Proceedings., 51st, pp.91-97, 2001

  • Moores, K.A.; Joshi, Y.K.; Schiroky, G.;, "Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins," Thermal and Thermomechanical Phenomena in Electronic Systems. ITHERM 2000. The Seventh Intersociety Conference, vol.2, pp.385-390 vol. 2, 2000

  • J. Schulz-Harder; "Efficient cooling of power electronics," Power Electronics Systems and Applications. PESA 2009. 3rd International Conference, pp.1-4, 20-22 May 2009

  • Kaufmann, S.; Lang, T.; Chokhawala, R.; "Innovative press pack modules for high power IGBTs," Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium, pp.59-62, 2001

  • ABB homepage. [Online]. Available: http://www.abb.com

  • Westcode homepage. [Online]. Available: http://www.westcode.com

  • Thermacore homepage [Online]. Available: http://www.thermacore.com

  • Repas, R. and Gernert, N. J., "Heat Pipes Get The Heat Out of Multikilowatt Electronic Devices", Thermacore Inc., Lancaster, Pa. 21 Oct. 2010.

  • Howes, J.C.; Levett, D.B.; Wilson, S.T.; Marsala, J.; Saums, D.L.; "Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF)," Semiconductor Thermal Measurement and Management Symposium. Semi-Therm 2008. Twenty-fourth Annual IEEE, pp.9-15, 16-20 March 2008

OPEN ACCESS

Journal + Issues

Search