Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.
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A. D. Rajapakse, A. M. Gole, and P. L. Wilson, "Approximate loss formulae for estimation of IGBT switching losses through EMTP-type simulations," presented at the 6th Int. Conf. Power System Transients, Montreal, QC, Canada, Jun. 19-23, 2005.
H. Rüedi and D. Tollik, "Development of Modular High-Power IGBT Stacks", Power Conversion Conference PCIM 2001, Nuremberg, Germany, June 2001, pp.1-6.
B.-C. Charboneau, "Double-sided liquid cooling for power semiconductor devices using embedded power technology," M.S. thesis, Blacksburg, Virginia: Virginia Polytechnic institute and State University, 2005, pp. 1-2…17-23.
G. Feix; Dieckerhoff, S.; Allmeling, J.; Schonberger, J., "Simple methods to calculate IGBT and diode conduction and switching losses", Power Electronics and Applications, EPE '09 13th European Conference, 8-10 Sept. 2009, pp.1-8.
Ahmed, M.M.R.; Putrus, G.A.; Ran, L.; "Predicting IGBT junction temperature under transient condition," Industrial Electronics, 2002. ISIE 2002. Proceedings of the 2002 IEEE International Symposium, pp. 874-877 vol.3, 2002
M. Iyengar, Garimella, S. V.; "Thermal Optimization and Design for Manufacturability of Liquid-Air Hybrid Cooling Systems, " Electronics Cooling Vol. 14(3), pp. 14-21, August 2008.
Jeffers, N., Punch, J. and Walsh, E., "An Experimental Characterisation of Miniature-Scale Cold Plates for Electronics Cooling Applications", Proceedings ASME-JSME Thermal Engineering and Summer Heat Transfer Conference, HT2007-321537, Vancouver, BC, Canada, July 8-12, 2007.
Chia-Pin Chiu; Biju Chandran; Mello, K.; Kelley, K., "An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications," Electronic Components and Technology Conference, 2001. Proceedings., 51st, pp.91-97, 2001
Moores, K.A.; Joshi, Y.K.; Schiroky, G.;, "Numerical and experimental thermal characterization of a liquid cooled AlSiC power electronics base plate with integral pin fins," Thermal and Thermomechanical Phenomena in Electronic Systems. ITHERM 2000. The Seventh Intersociety Conference, vol.2, pp.385-390 vol. 2, 2000
J. Schulz-Harder; "Efficient cooling of power electronics," Power Electronics Systems and Applications. PESA 2009. 3rd International Conference, pp.1-4, 20-22 May 2009
Kaufmann, S.; Lang, T.; Chokhawala, R.; "Innovative press pack modules for high power IGBTs," Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium, pp.59-62, 2001