Electro-conductive (EC) yarns can be woven into a hybrid fabric to enable electrical current to flow through the fabric from one component A to another component B. These hybrid fabrics form the bases of woven e-textiles. However, at the crossing point of an EC yarn in warp and in weft direction, there is a contact resistance and thus generation of heat may occur in this area. Both phenomena are inseparable: if the contact resistance in the EC contact increases, the generated heat will increase as well. Predicting this electrical and thermal behavior of EC contacts in hybrid woven fabrics with stainless steel yarns is possible with a mathematical model based on the behavior of a metal oxide varistor (MOV). This paper will discuss in detail how this can be achieved.
 Dhawan, A., Seyam, A. M., Ghosh, T. K., Muth, J. F. (2004). Woven fabric-based electrical circuits. Part I: evaluating interconnect methods. Textile Research Journal, 913-919.
 Stoppa, M., Chiolerio, A. (2014). Wearable electronics and smart textiles: a critical review. Sensors, 11957-11992.
 Linz, T., Simon, E., Walter, H. (2012). Modeling embroidered contacts for electronics in textiles. Journal of the Textile Institute, 644-653.
 Vasile, S., Deruck, F., Hertleer, C., De Raeve, A., Ellegiers, T., De Mey, G. (2017). Study of the contact resistance of interlaced stainless steel yarns embedded in hybrid woven fabrics. AUTEX Research Journal, 170-176.
 Liu, S., Tong, J., Yang, C., Li, L. (2016). Smart e-textile: resistance properties of conductive knitted fabric - Single pique. Textile Research Journal, 1669-1684.
 Moritz, A. R., Henriques, F. C. (1947). Studies of thermal injury II: The relative importance of time and surface temperature in the causation of cutaneous burns. The American Journal of Pathology, 23(5), 695-700.
 Banaszczyk, J., De Mey, G., Anca, A., Schwarz, A., Van Langenhove, L. (2009). Contact resistance investigation between stainless steel electroconductive yarns, in 16th International Conference: Mixed Design of Integratioed Circuits and Systems, Lodz.