Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

Open access

Abstract

Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.

[1] J. Yin, Z. Liang, J.D. Wyk, IEEE Trans. Power Electron. 22, 392 (2007).

[2] J.E. Lee, K.S. Kim, K. Suganuma, J. Takenaka, K. Hagio, Mater. Trans. 46, 2413 (2005).

[3] E. Halonen, T. Viiru, K. Östman, A.L. Cabezas, M. Mäntysalo, IEEE Trans. Compon. Packag. Manuf. Technol. 3, 350 (2013).

[4] N.S. Bosco, F.W. Zok, Acta Mater. 53, 2019 (2005).

[5] J.F. Li, P.A. Agyakwa, C.M. Johnson, Acta Mater. 59, 1198 (2011).

[6] M.S. Park, S.L. Gibbons, R. Arróyave, Acta Mater. 60, 6278 (2012).

[7] W. Gierlotka, S.W. Chen, S.K. Lin, J. Mater. Res. 22, 3158 (2007).

[8] H. Flandorfer, U. Saeed, C. Luef, A. Sabbar, H. Ipser, Thermochim. Acta 459, 34 (2007).

Archives of Metallurgy and Materials

The Journal of Institute of Metallurgy and Materials Science and Commitee on Metallurgy of Polish Academy of Sciences

Journal Information


IMPACT FACTOR 2016: 0.571
5-year IMPACT FACTOR: 0.776

CiteScore 2016: 0.85

SCImago Journal Rank (SJR) 2016: 0.347
Source Normalized Impact per Paper (SNIP) 2016: 0.740

Metrics

All Time Past Year Past 30 Days
Abstract Views 0 0 0
Full Text Views 195 152 6
PDF Downloads 95 86 2