The Influence of Soldering Conditions on Conductivity, Structure and Strength of Cu/Sn96Ag4 Solders

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The Influence of Soldering Conditions on Conductivity, Structure and Strength of Cu/Sn96Ag4 Solders

In the paper the electrical properties of the Cu/Sn96Ag4 solders were studied. The studied solders were produced at 200, 220 and 250°C and within time range 3 to 90 s. Soldering temperatures were chosen to assure the best soldering conditions for the Cu/Sn96Ag4 alloy. The most appropriate temperature of 200°C is the one just above the melting point. The temperature of 250°C is the maximal one recommended by producers, which can be applied for the electronic elements during soldering. The studies have shown that the best electrical properties and tensile strength Rm have samples soldered at times 3 and 30 s, while the highest specific resistance together with the lowest Rm value are observed for samples soldered at the time of 10 s. The soldering temperature have small influence on the strength of the connection/bond however it shows significant affect on the electrical properties.

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Archives of Metallurgy and Materials

The Journal of Institute of Metallurgy and Materials Science and Commitee on Metallurgy of Polish Academy of Sciences

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IMPACT FACTOR 2016: 0.571
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CiteScore 2016: 0.85

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