Cu Thin Films Deposited by DC Magnetron Sputtering for Contact Surfaces on Electronic Components
The results of the DC magnetron sputtering of copper thin films with different parameters of deposition are presented. The main aim of studies was to determine the influence of current value, time of deposition and target-substrate distance on morphology and grain size of obtained copper thin films. The effects of film's thickness on the resistivity of copper thin films were investigated. The influence of parameters on the rate of deposition was also determined. The possibility of application of resulting films for contact surface in electronic components was discussed. The morphology was characterized by AFM method, the size of Cu deposited grains was calculated using Scherrer's method. The WDXRF method was used for estimate of thickness of sputtered films. The resistivity of obtained films was measured using four probe method.