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R.V. Bogdanov and O.M. Kostiukevych

nizkotemperaturnoy plazmy dlya naneseniya tonkih plenok, M., Energoatomizdat, 1989 (in Russian). [5] KUZMICHEV A.I. Magnetronnyie raspilitenye systemy. Kniga 1. Vvedenie v fiziku i tehniku magnetronnogo raspilenija, Avers, Kiev, 2008 (in Russian). [6] DEPLA D., MAHIEU S. AND GREENE J.E., Sputter Deposition Processes, Processing in: MARTIN P.M. Handbook of Deposition Technologies for Films and Coatings, Third Edition: Science, Applications and Technology, William Andrew, 2010, p. 253. [7] KASHTANOV P.V., SMIRNOV B.M., HIPPLER R

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Marzena Fejdyś, Karolina Olszewska, Sylwia Kaczmarczyk and Grzegorz Owczarek

72, 241-248. DOI: 10.1016/j. vacuum.2003.08.003. 11. Barshilia, H.C., Prakash, M.S., Jain, A. & Rajam, K.S. (2005). Structure, hardness and thermal stability of TiAlN and nanolayered TiAlN/CrN multilayer fi lms. Vacuum 77, 169. DOI: 10.1016/j.vacuum.2004.08.020. 12. Grips, V.K., Selvi, V.E., Barshilia, H.C. & Rajam, K.S. (2006). Effect of electroless nickel interlayer on the electrochemical behavior of single layer CrN, TiN, TiAlN coatings and nanolayered TiAlN/CrN multilayer coatings prepared by reactive dc magnetron sputtering

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Wojciech Starosta, Viera K. Semina, Jerzy Smolik, Lech Waliś, Michał Rydzewski and Bożena Sartowska

., Porter, D. L., Hayes, S. L., Cole, J. I., & Bai, X. (2013). Novel accident-tolerant fuel meat and cladding. In Top Fuels, September 15–19, 2013, Charlotte, NC, USA (pp. 763–770). 21. Yeom, H., Maier, B., Mariani, R., Bai, D., Fronek, S., Xu, P., & Sridharan, K. (2017). Magnetron sputter deposition of zirconium-silicide coating for mitigating high temperature oxidation of zirconium-alloy. Surf. Coat. Technol ., 316 , 30–38. http://dx.doi.org/10.1016/j.surfcoat.2017.03.018 . 22. Kaiser, A., Lobert, M., & Telle, R. (2008). Thermal stability of zircon (ZrSiO

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Pamela Miśkiewicz, Iwona Frydrych, Wojciech Pawlak and Agnieszka Cichocka

] Knotek, O., Löffler, F., Krämer G. (1993). Process and advantage of multicomponent and multilayer PVD coatings. Surface and Coatings Technology, Vol. 59, Issues 1–3, pp. 14-20. [8] Yip, J., Jiang, S., Wong, CH. (2009). Characterization of metallic textiles deposited by magnetron sputtering and traditional metallic treatments. Surface and Coatings Technology, Vol. 204, Issue 3, pp. 380-385. [9] Jiang, S.X., Qin, W.F., Guo, R.H., Zhang, L. (2010). Surface functionalization of nanostructured silver-coated polyester fabric by magnetron sputtering. Surface and

Open access

A. Kavitha, R. Kannan and S. Rajashabala

]. Microscale transition-metal thin films have been developed by many researchers using PVD techniques, such as vacuum arc evaporation [ 5 , 6 ], cathode arc [7] , reactive sputtering [ 8 – 10 ] and ion plating [ 11 , 12 ], etc. Out of these deposition techniques, sputtering was modified with supported discharge/triode magnetron sputtering. DC sputtering method with supported discharge gives high purity, good adhesion and high deposition rates due to lower operation pressure even at room temperature deposition, controlled deposition rates and crystalline structure in

Open access

K. Tadaszak, K. Nitsch, T. Piasecki and W. Posadowski

Abstract

Pulsed magnetron sputtering of metal targets in the presence of reactive gas is widely used to deposit compound materials. This method is very popular but still the aim of research is to obtain more stable and efficient processes. The standard procedure of compound thin film deposition is sputtering in so called reactive mode of magnetron work — sputtering of the target surface covered with the formed compound. The authors postulate that the problem of low deposition rate of reactive compounds can be solved if the magnetron source operates in the metallic mode or near the border of metallic and transient mode. Aluminium oxide thin films were deposited using high effective reactive pulsed magnetron sputtering. The main purpose of the research was electrical characterization of metal-compound-metal structures in the wide range of frequencies and determination of deposition technique influence on the thin film properties.

Open access

Ştefan Ţǎlu, Sebastian Stach, Shahoo Valedbagi, S. Mohammad Elahi and Reza Bavadi

] MountainsMap ® 7 Software (Digital Surf, Besançon, France). Available at: http://www.digitalsurf.fr (last accessed on September 10, 2014). [16] ZOLOTAREVSKII S.Y., NOVIKOV D.A., GUSEV A.S., LYASKOVSKII V.L., Meas. Tech.+, 56 (3) (2013), 247. [17] ALMTOFT K.P., PhD Thesis: Structural characterization of nanocrystalline thin films grown by magnetron sputtering, University of Aarhus, Denmark, 2006. [18] YADAV R.P., DWIVEDI S., MITTAL A.K., KUMAR M., PANDEY A.C., Appl. Surf. Sci., 261 (2012), 547. [19] ŢĂLU Ş

Open access

K. Nowakowska-Langier, R. Chodun, K. Zdunek, R. Minikayev and R. Nietubyc

Abstract

AlN films on a Si substrate were synthesized by magnetron sputtering method. A dual magnetron system operating in AC mode was used in the experiment. Processes of synthesis were carried out in the atmosphere of a mixture of Ar/N2. Morphology and phase structure of the AlN films were investigated at different pressures. Structural characterizations were performed by means of SEM and X-ray diffraction methods. Our results show that the use of magnetron sputtering method in a dual magnetron sputtering system is an effective way to produce AlN layers which are characterized by a good adhesion to the silicon substrate. The morphology of the films is strongly dependent on the Ar/N2 gas mixture pressure. An increase of the mixture pressure is accompanied by a columnar growth of the layers. The films obtained at the pressure below 1 Pa are characterized by finer and compacter structure. The AlN films are characterized by a polycrystalline hexagonal (wurtzite) structure in which the crystallographic orientation depends on the gas mixture pressure.

Open access

K. Mech, R. Kowalik and P. Żabiński

Cu Thin Films Deposited by DC Magnetron Sputtering for Contact Surfaces on Electronic Components

The results of the DC magnetron sputtering of copper thin films with different parameters of deposition are presented. The main aim of studies was to determine the influence of current value, time of deposition and target-substrate distance on morphology and grain size of obtained copper thin films. The effects of film's thickness on the resistivity of copper thin films were investigated. The influence of parameters on the rate of deposition was also determined. The possibility of application of resulting films for contact surface in electronic components was discussed. The morphology was characterized by AFM method, the size of Cu deposited grains was calculated using Scherrer's method. The WDXRF method was used for estimate of thickness of sputtered films. The resistivity of obtained films was measured using four probe method.

Open access

Konstanty Marszałek, Jacek Stępień and Ryszard Mania

self-propagating exothermic reactionsin Al/Ni nanolaminate foils, J. Appl. Phys., 87 1255. [11] Ramos A.S., Vieira M.T., Morgiel J., Grzonka J., Simöes S., Vieira M.F., (2009), Production of intermetallic compounds from Ti/Al and Ni/Al multilayer thin films–A comparative study, Journal of Alloys and Compounds, 484335. [12] Marszałek K., Mania R., (2011), Sputtering system for thin (TiAl)N film deposition on cemented carbide, Elektronika, R. 52, nr 8, 70-72. (in Polish) [13] Marszałek K., Sobków Z. , Cioruń J., (2009), LabVIEW controller for sputtering process