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Emil Lechovič, Beáta Szewczyková, Erika Hodúlová and Koloman Ulrich

References LECHOVIČ, E. et al. Spoľahlivosť a životnosť bezolovnatých spájkovaných spojov. In Zvárač , 2008, roč. 5, č. 4, s. 10-13. ISSN 1336-5045 MATTILA, T. Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections. Helsinki: University of Technology, 2007. ISBN 0-387-27974-1 LAURILA, T., et al. Interfacial reactions between lead-free solders and common base materials. In Materials Science and Engineering , 2005, roč. 49. [online]. http

Open access

Alexandr Otáhal and Ivan Szendiuch

) during the Early Stages of Lead-Free Soldering”, Acta Materialia vol. 60, 2012, pp. 923–934. [4] M. L. Huang and F. Yang, “Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints”, Journal of Materials Science and Technology vol. 31, 2015, pp. 252–256. [5] C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, “Effect of Cu concentration on the reactions between Sn-Ag-Cu Solders and Ni”, Journal of Electronic Materials vol. 31, no. 6, 2002, pp. 584–590. [6] R. Pandher and A

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Michal Prach, Igor Kostolný and Roman Koleňák

References 1. SUGANUMA, K., KIM S. J., KIM K. S., 2009. High-Temperature Lead-Free Solders: Properties and Possibilities. JOM, Vol. 61, No. 1, pp. 64-71 2. KROUPA, A., ANDERSSON, D., HOO, N. et al., 2012. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering. Journal of Materials Engineering and Performance, Vol. 21(5), pp. 629-637 3. MA, L., LONG, W., et al., 2013. Development of a Binary Zn-Based Solder Alloy for Joining Wrought Magnesium Alloy AZ31B. ASM International, Vol. 22, Is. 1

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R. Koleňák, M. Martinkovič and M. Koleňáková

References [1] K. Suganuma, S.J. Kim, K.S. Kim, High-temperature lead-free solders - Properties and possibilities, Journal of the Minerals, Metals and Materials Society 61 1, 64-71 (2009). [2] H.J. Kim, W.S. Jeong, M.H. Lee, Thermodynamics - Aided Alloy Design and Evaluation of Pb - free Solders for High - Temperature Applications, Materials Transactions 43 8, 1873-1878 (2002). [3] N.J. Lalena, F.J. Nancy, W.M. Weiser, Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for

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Roman Koleňák, Peter Žúbor, Monika Koleňáková and Martin Provazník

References SCHWARTZ, M. M. Handbook of Structural Ceramics. McGraw - Hill, Inc., New York, 1992. HUMPSTON, G., JACOBSON, M. D. Principles of Soldering and Brazing. ASTM Int., 1994. http://www.handyharmancanada.com/TheBrazingBook/bbook.htm KAPOOR, R. R., EAGAR, W. T. Metall. Trans. B, Vol. 20B, 1989, pp. 919-924. XIAN, A. P. Journal of Materials Science, Vol. 32, No. 23, 1997, pp. 6387-6393. HODÚLOVÁ, E

Open access

Goran Tasevski and Elena Papazoska

Abstract

Selective soldering is the process of soldering components to printed circuit boards that could not be treated in a reflow oven in a traditional surface-mount technology process due to thermal shock and damaging. Process of flux appliance as a first step of the selective soldering process sets the baseline for achieving high quality and robustness of the soldered joints.

Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.

Open access

M. Kawiak and J. Nowacki

Abstract

The cellular structure and unique properties of aluminum foams are the reason of problems concerning their cutting and bonding. The content of the paper includes characterization of the essence of properties and application of aluminum foams, limitations and chances of aluminum foams soldering. The aim of the research is consideration of possibilities and problems of soldering AlSi foams and AlSi - SiC composite foams as well as mechanical properties. The possibility of soldering AlSi foams and AlSi - SiC composite foams using ZnAl solders was confirmed and higher tensile strength of the joint than the parent material was ascertained

Open access

A. Gyenes, M. Benke, N. Teglas, E. Nagy and Z. Gacsi

REFERENCES [1] K.J. Puttlitz, K.A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, New York: Marcel Dekker (2004). [2] J. Bath, Lead-Free Soldering, New York: Springer (2007). [3] J.H.L. Pang, Lead Free Solder, Mechanics and Reliability, New York: Springer (2012). [4] T.K. Lee, T.R. Bieler, C.U. Kim, H. Ma, Fundamentals of Lead-Free Solder Interconnect Technology; From Microstructures to Reliability, New York: Springer (2015). [5] A.Z. Miric, New developments in high-temperature, high-performance lead

Open access

Martin Provazník, Roman Koleňák and Monika Koleňáková

References CHANG, S. Y., TSAO, L. C., CHIANG1, M. J., CHUANG, T. H., TUNG, C. N. Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler. In Journal of Materials Engineering and Performance , 2003, No. 4, pp. 383-389. KOLEŇÁK, R. Solderability of metal and ceramic materials by active solders. Dresden: Forschungszentrum Dresden, 2008. 72 p. ADAMČÍKOVÁ, A. Study of ceramics wetting by lead- free solders , (Štúdium zmáčania keramiky

Open access

G. Boczkal, P. Marecki and M. Perek-Nowak

References ISO/CD 857-2 Welding and allied processes - Vocabulary - Part 2 Soldering and brazing processes and related terms. E. Bradley, C. A. Handwerker, Lead-Free Electronics. IEEE Press, Wiley-Interscience 2007. M. Abtew, G. Selvaduray, Materials Science and Engineering 27 , 95-141 (2000). A. Winiowski, W. Gawrysiuk, Archives of Metallurgy and Materials 51 , 399-405 (2006). S. Choi, J. P. Lucas, Journal of Materials Science