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Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

these plates, the wafers are rubbed against fine abrasive polishing pads along with polishing slurry to give a mirror like finish Establish optimum flatness. Eliminate surface damage. Minimise contamination level High rejection rate Rework cost The lapping process helps to achieve the maximum wafer flatness. Wafer flatness measured as Total Thickness Variation (TTV) in microns is one of critical-to-quality (CTQ) requirements for a silicon wafer. This project aimed to reduce the number of TTV rejects in the lapping process. 1 Literature review

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