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Cooling Methods for High-Power Electronic Systems

Cooling Systems, " Electronics Cooling Vol. 14(3), pp. 14-21, August 2008. Jeffers, N., Punch, J. and Walsh, E., "An Experimental Characterisation of Miniature-Scale Cold Plates for Electronics Cooling Applications", Proceedings ASME-JSME Thermal Engineering and Summer Heat Transfer Conference, HT2007-321537, Vancouver, BC, Canada, July 8-12, 2007. DAU Ges.m.b.H & CO.KG homepage. [Online]. Available: http://www.dau-at.com G. Upadhya, "Cooligy™ Active Micro-Structure™ Cooling Offers Key to

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Temperature Profiles in a Micro Processor Cooled by Direct Refrigerant Evaporation

-evaporation: A novel two-phase cooling cycle, IJR33 ( 2010 ) 1264 - 1276. 12. Wu, D., Marcinichen, J. B., Thome, J. R.: Experimental evaluation of a controlled hybrid two-phase multi-microchannel cooling and heat recovery system driven by liquid pump and vapor compressor, IJR 36 ( 2013 ) 375-389. 13. Silvério, V., Cardoso, S., Gaspar, J., Freitas, P. P., Moreira, A.L.N.: Design, fabrication and test of an integrated multi-microchannel heat sink for electronics cooling, Sensors and Actuators A 235 (2015) 14-27. 14. Marcinichen, J

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