J. Klavins, G. Mozolevskis, A. Ozols A., E. Nitiss and M. Rutkis
1. Gelorme, J.D., Cox, R.J., and Gurrierez, S.A. (1989). Photoresist composition and printed circuit boards and packages made therewith. US4882245A.
2. You, H., and Steck, A.J. (2013). Lightweight electrowetting display on ultrathin glass substrate. Society for Information Display, 21(5), 192-197.
3. MicroChem (2001). SU-8 Negative Tone Photoresist Formulations 50-100, Data sheets.
4. Luurtsema, G.A. (1997). Spin Coating for Rectangular Substrates. University of California
Jingning Han, Zhifu Yin, Helin Zou, Wenqiang Wang and Jianbo Feng
 BYIRINGIRO, J. B.-KO, T. J.-KIM, H. C.-LEE, I. H. : Optimal Conditions of SU-8 Mask for Micro-Abrasive Jet Machining of 3-D Freeform Brittle Materials, International journal of precision engineering and manufacturing 14 No. 11 (2015), 1989-1996.
 GUERIN, L. J.-TOROSDAGI, A.-EICHENBERGER, P.: High Aspect Ratio Planar Coils Embedded in SU8 Photoepoxy for MEMS Applicationsinbook In: 12th European Conference on Solid-State Transducers - 9th UK Conference on Sensors and their Applications.
Robert Andok, Anna Benčurová, Pavol Nemec, Anna Konečníková, Ladislav Matay, Jaroslava Škriniarová and Pavol Hrkút
In this article we describe the electron-beam direct-write (EBDW) lithography process for the AZ 5214E photoresist which is, besides its sensitivity to UV radiation, sensitive also to electrons. An adapted process flow is provided. At the same time we examine the resistance of this resist to RIE and its suitability as an etch-mask for etching thin Ag layers in N2 plasma. A comparison with several chosen resists (PMMA, ma-2405, ma-N 1402, SU-8 2000) is provided.
-H, Parmeggiani, C., & Wiersma, D. (2014). High-Resolution 3D Direct Laser Writing for Liquid-Crystalline Elastomer Microstructures. Advanced materials, 26, 2319-22.
10. Williams, H.E., Freppon, D.J., Kuebler, S.M., Rumpf, R.C., & Melino, M.A. (2011). Fabrication of three-dimensional micro-photonic structures on the tip of optical fibers using SU-8. Opt. Express, 19 , 22910-22922. DOI: 10.1364/OE.19.022910.
11. Kowalczyk, M., Haberko, J., & Wasylczyk, P. (2014). Microstructured gradient-index antireflective coating fabricated on a fiber tip with direct laser writing
Yaqin Fan, Chunlan Tang, Qing Hu, Yonglin Lei and Jichuan Huo
), 1217-1226. DOI: 10.1007/s 10973-016-5951-3.
27. Monteserín, C., Blanco, M., Aranzabe, E., Aranzabe, A. & Vilas, J.L. (2017). Effects of graphene oxide and chemically reduced graphene oxide on the curing kinetics of epoxy amine composites. J. Appl. Polym. Sci. 134 (19) 44803. DOI: 10.1002/app.44803.
28. Sharif, M., Pourabbas, B., Sangermano, M., Sadeghi Moghadam, F., Mohammadi, M. & Roppolo, I., et al. (2017). The effect of graphene oxide on uv curing kinetics and properties of su8 nanocomposites. Polymer International, 66. 405.DOI: 10
A. Katunin, K. Krukiewicz, A. Herega and G. Catalanotti
., Beche B., Poncin-Epaillard F.: Development of an optical ammonia sensor based on polyaniline/epoxy resin (SU-8) composite, Talanta 77 (2009) 1590-1596.
61. Oyharcabal M., Olinga T., Foulc M.P., Vigneras V.: Polyaniline/clay as nanostructured conductive filler for electrically conductive epoxy composites. Influence of filler morphology, chemical nature of reagents, and curing conditions on composite conductivity, Synthetic Metals 162 (2012) 555-562.
62. Schettini A., Peres R.C.D., Soares B.G.: Synthesis of polyaniline/camphor sulfonic acid in formic acid
Afia Asif, Saed Khawaldeh, Muhammad Salman Khan and Ahmet Tekin
-out metabolites from cells as a result of drug exposure in order to confirm the quantitative results once again using LC-MS analysis.
The materials used for the microfluidics chips are SU-8 photoresist compound, PGMEA developer, PDMS base and agent. The fluids for testing simulations are vegetable oil and water, while the real time application materials are targeted as cultured cancer cells, specialized drugs, and a growth medium.
Implementation and Experimentation
Several geometries with different dimensions were initially designed and optimized in order to come up
using positive photoresist and then the Cr and Au layers were selectively removed by wet etching process to define the metal patterns on the substrate. Finally, a second lithography step was performed to apply another photosensitive polymer (SU8) layer as passivation coating over the metal electrodes. In this step, only the electrode sensors and contact pads were exposed to make contact with the electrolyte as shown in Fig.1 .
Microphotograph of different three-electrode devices.
The photoresist was hard baked to impart stability and inertness to
define the metal patterns on the substrate. Finally, a second lithography step was performed to apply another photosensitive polymer (SU8) layer as a passivation coating over the metal electrodes. In this step, only the electrode sensors and contact pads were exposed to make contact with the electrolyte as shown in Fig. 2 .
Microphotograph of different three-electrode devices. Inset is the enlarged view of Design 4.
The photoresist was hard baked to impart stability and inertness to the polymer. The wafers were then diced into single devices for
mask and cut to size before being attached to the substrate using double sided 10 μm thickness adhesive tape (Adhesives Research, USA). The geometry of the electrodes is shown in Fig. 3 :
Schematic and geometry of the impedance sensor.
The PDMS layer was formed by first creating a negative master mould from SU-8 2150 (Microchem, USA). The 500 μm thick SU-8 mould was patterned using photo-lithography on a silicon wafer. The PDMS was formed from a two part mix (Sylgard 184, Dow Corning, USA) and poured into the mould and left to cure and outgas for