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Theoretical Study on Adhesives Used in Ballistic Protection Structures and Transparent Armor

References 1. R. Zaera, S. Sánchez-Sáeza, J.L. Pérez-Castellanos, and C. Navarro, “Modelling of the adhesive layer in mixed ceramic/metal armours subjected to impact”, Composites, 31, Part A: Applied Science and Manufacturing (2000): 823-833. 2. National Research Council, Opportunities in Protection Materials Science and Technology for Future Army Applications, (Washington D.C.: The National Academies Press, 2011). 3. G.F. Freeguard, and D. Marshall, “Bullet-resistant glass: A review of product and process

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Electrically conductive acrylic pressure-sensitive adhesives containing carbon black

, Z. & Klementowska-Witkowska, P. (2007) Electrical conductive acrylic pressure-sensitive adhesives. Pitture e Vernici European Coatings, 11, 101-108. Danes, F., Garnier, B. & Dupuis, T. (2005) Non-uniformity of the filler concentration and of the transverse thermal and electrical conductivities of filled polymer plates. Compos. Sci. Technol. 65, 945-951. DOI:10.1016/j.compscitech.2004.10.020. Poh, B.T., Giam, Y.F. & Yeong, F.P. (2010) Tack and shear strength of adhesives prepared from styrene-butadiene rubber

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Development of photoreactive UV-crosslinkable solvent-free acrylic pressure-sensitive adhesives coated at room temperature and used for removable and repositionable self-adhesive materials

, M., (2007) Synthesis of photoreactive solvent-free acrylic pressure-sensitive adhesives in the recovered system. Pol. J. Chem. Tech. 9, (2), 5. DOI: 10.2478/v10026-007-0014-y. Hofmockel, U. (1992). Photoinitiatoren: Heute und Morgen, 17. Münchener, Klebstoff- und Veredelungsseminar, 26-28. October 1992, (pp 177). München, Germany. Baeumer, W., Köhler, M. & Ohngemach, I. (1986). Copolymerizable Photoinitiators, Radcure 86, 25-29 March 1986, Baltimore, USA, 43. Czech, Z. & Butwin, A

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Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

.-STEJSKAL, J. : Printed Flexible Gas Sensors based on Organic Materials, Procedia Eng. 120 (2015), 614-617. [4] MACH, P.-DURAJ, A.-BUŠEK, D.-DUŠEK, K. : Influence of Combined Ageing on Resistance and Noise of Electrically Con- ductive Adhesive Joints, 1st Int. Microelectron. Assem. Packag. Soc. Flash Conf., 2015, pp. 42-43. [5] ZHANG, R.-AGAR, J. C.-WONG, C. P. : Recent Advances on Electrically Conductive Adhesives, 12th Electron. Packag. Technol. Conf. no. c, 2010, pp. 696-704. [6] BARTO, S.-CINERT, J.-MACH, P. : Influence of

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UV-crosslinkable warm-melt pressure-sensitive adhesives based on acrylics

References Benedek, I. (2006). Developments in Pressure-Sensitive Products, Edited by Istvan Benedek, Taylor & Francis a CRC Press Book, New York, USA. Satas, D. (1982). Handbook of Pressure Sensitive Technology, Van Nostrand-Rheinhold Co, New York, USA. Czech, Z., Pełech, R. & Zych, K. (2009). Thermal decomposition of acrylic pressure-sensitive adhesives. Polish Journal of Chemical Technology. 11, 4, 7-12. DOI: 10.2478/v10026-009-0036-8. Houwink, R

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Ultrastructure of adhesive bond of composite to dentin

References 1. Yesilyurt C, Bulueu B. Bond strength of Total-etch dentin Adhesive Systems on Peripheral and Central dentinal Tissue: A Microtensile Bond Strength Test. J Contemp Dent Pract. 2006; 2(7):1-12. 2. Van Meerbeek B, De Munck J, Yoshida Y et al. Buonocore memorial lecture. Adhesion to enamel and dentin: current status and future challenges. Oper Dent. 2003; 28(3):215-35. 3. Van Meerbeek B. Mechanism of resin Adhesion - Dentin and enamel Bonding. Compendium of Continuing Education in Dentistry. 2010; 9

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Thermal decomposition of acrylic pressure-sensitive adhesives

References Czech, Z. & Pełech, R. (2009). The thermal degradation of acrylic pressure-sensitive adhesives based on butyl acrylate and acrylic acid. Progress in Organic Coatings. 65, 84-87. DOI: 10.1016/j.porgcoat.2008.09.017. Cieślik, M. (2008). Synthesis and Application of Waterborne Polyurethane Pressure- sensitive Adhesives. Doctoral dissertation, Szczecin University of Technology, Institute of Organic Chemical Technology, Szczecin, Poland. Czech, Z. & Wesołowska, M. (2007

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Acrylic Pressure-Sensitive Adhesives Containing SiO2 Nanoparticles

References 1. Imerito, T. (2005). Nanotechnology building from the bottom and building the bottom line. JOM 57 (12), 18-23. DOI: 10.1007/s11837-005-0177-z. 2. Murad, D.S. (2002). It`s a small world after all. Adhesives Age , October, 40-44. 3. Frisch, F. (2003). Nanotechnology gives a boost to adhesive technology. Adhäsion 4 (47), 16-19. 4. Krüger, G. (2006). Nanoparticles of SiO 2 , ZrO 2 and BaSO 4 in Acrylate Dispersions. Coating 3, 113-115. 5. Sprenger, S

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On the Areospace-Grade Adhesives Shear Strength Testing with ASTM D5656 Test as an Example

BIBLIOGRAPHY [1] Higgins A., 2000, “Adhesive bonding of aircraft structures”, Int. Journal of Adhesion & Adhesives, No. 20, pp. 367-376. [2] Öchsner A., Genger J., 2004, “Critical analysis of the substrate deformation correction in the thick adherend tensile-shear test”, Int. Journ. Of Adhesion & Adhesives, No. 24, pp. 37-41. [3] ASTM D5656, “Standard test method for thick adherend metal lap-shear joints for determination of the stress-strain behavior of adhesives in shear by tension loading”. [4] Seneviratne W.P., Tomblin J.S., 2011

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Water-borne pressure-sensitive adhesives acrylics modified using amorphous silica nanoparticles

LITERATURE CITED 1. Czech, Z. (1999). Crosslinking of pressure-sensitive adhesives based on acrylics, Ed. Szczecin University of Technology, Szczecin, ISBN 83-87423-18-1. 2. Zosel, A. (1985) Adhesion and Tack of Polymers: Influence of Mechanical Properties and Surface Tensions. Coll. & Pol. Sci. 263(7), 541–553. DOI: 10.1007/BF01421887. 3. Czech, Z. & Wesolowska, M. (2007). Development of solvent-free acrylic pressure-sensitive adhesives. Eur. Pol. J. 43, 3604–3612. DOI: 10.1016/j.eurpolymj.2007.05.003. 4. Czech, Z. (2003

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