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Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

flattening process, and then undergoes the fabrication process producing IC chips. The focus of this research project is on the silicon wafer manufacturing. The silicon wafer manufacturing consists of four key value-adding processes: slicing, lapping, chemical etching and polishing. The primary aim of the slicing process is to define the crystal structure of the wafer, finding the best possible shape. The wafer is subjected to high-pressure cutting, to achieve correct wafer thickness, but on the downside, it causes high surface damage and contamination. The second stage

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