The laser processing of materials which are highly reflective at laser wavelengths is problematic. We have to take into account that only a small part of the energy is absorbed, the main part being reflected. In this article we examine the laser processing of highly reflective copper and silver at 1070 nm wavelength. In laser drilling of printed circuit boards it is necessary to drill copper layer as well. In highly reflecting materials we can drill smaller holes because of the low energy efficiency. Naturally in single pulse laser drilling the focus position plays a key role: at the focal spot of the laser beam smaller diameter holes are produced, further from the focal spot, higher diameter holes are produced.