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O. A. Kovtun, R. S. Vargovitsh, M. O. Son and I. A. Balashov

Abstract

A finding of the subterranean population of the Caucasian invasive snail on the depth of 30 m below Odesa in Southern Ukraine is discussed.

Open access

S.S. Kim, I. Son and K.T. Kim

Abstract

In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.

Open access

S.H. Park, D.B. Kim, R.G. Lee and I.J. Son

Abstract

This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The manufacturing route involved electroless plating of copper in the graphite flake and sintering process are optimized. The microstructures, interface, thermal properties, and relative density of graphite/Cu composites are investigated. The relative density of the composites shows 99.5% after sintering. Thermal conductivities and coefficients of thermal expansion of this composites were 400-480 Wm−1K−1 and 8 to 5 ppm k−1, respectively. Obtained graphite nanoplatelets-reinforced composites exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.