Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

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Abstract

In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.

[1] F.J. Disalro, Science 285, 703-706 (1999).

[2] D.Y. Chung, T. Hogan, P. Brazis, M. Rocci-Lane, C. Kannewurf, M. Bastea, C. Uher, M.G. Kanatzidis, Science 287, 1024-1027 (2000).

[3] K.T. Kim, S.Y. Choi, E.H. Shin, K.S. Moon, H.Y. Koo, G.G. Lee, G.H. Ha, Carbon 52, 541-549 (2013).

[4] K.T. Kim, I.J. Son, G.H. Ha, J. Kor. Powd. Met. Inst. 20 (5), 345-349 (2013).

[5] M.S. Park, H.Y. Koo, G.H. Ha, Y.H. Park, J. Kor. Powd. Met. Inst. 22 (4), 254-259 (2015).

[6] H. Wada, K. Takahashi, T. Nishizaka, J. Mater. Sci. Lett. 9, 810-812 (1990).

[7] D. Vasilevskiy, F. Roy, E. Renaud, R.A. Masut, S. Turenne, Proc. 25th Int. Conf. on Thermoelectrics, Vienna, Austria, 666-669 (2006).

[8] T.Y. Lin, C.N. Liao, Albert T. Wu, J. Electron. Mater. 41 (1), 153-158 (2012).

[9] S.W. Chen, C.N. Chiu, Scripta Mater. 56, 97-99 (2007).

Archives of Metallurgy and Materials

The Journal of Institute of Metallurgy and Materials Science and Commitee on Metallurgy of Polish Academy of Sciences

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IMPACT FACTOR 2016: 0.571
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CiteScore 2016: 0.85

SCImago Journal Rank (SJR) 2016: 0.347
Source Normalized Impact per Paper (SNIP) 2016: 0.740

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